DID YOU MISS HYVE SOLUTIONS AT THE OCP GLOBAL SUMMIT?
Registration is free.
In addition, learn about Hyve Solutions’ offerings and market insights through the following engagements:
Presented by Hyve Solutions
On Demand (45 minutes)
PANELISTS:
Jay Shenoy, Vice President, Technology, Hyve Solutions
Anjaneya (Reddy) Chagam, Senior Principal Engineer, Intel
Manoj Wadekar, Storage Hardware Architect, Facebook
Parantap Lahiri, VP of Network Engineering and Data Centers, eBay
Dr. Jai Menon, Chief Scientist, Fungible
Amir Michael, Chief Technology Evangelist, Lightbits
DESCRIPTION:
Panelists discuss efficient ways to address the complexity of
engineering and planning challenges in hyperscale data centers. With extensive experience
in architecting and deploying hyperscale infrastructure, this panel of subject matter
experts cover key issues in disaggregating data centers and how to address them.
Presented by Hyve Solutions
On Demand (15 minutes)
SPEAKER:
Alekhya Addagatla, Thermal Engineer, Hyve Solutions
DESCRIPTION:
Join Hyve Solutions for a presentation on the use of a scalable hybrid liquid cooling system which
utilizes cold plates and cooling fluid in direct contact with high-heat generating components to
transfer heat away from the components to the liquid-to-air heat exchangers. This solution is
applicable to large-scale data centers, allowing for higher-power density, efficiency and performance
without the need to update facility cooling infrastructure.
On Demand (30 minutes)
PANELISTS:
Emilie Yang, Sr. Technical Program Manager, Hyve Design Solutions
DESCRIPTION:
The industry has successfully powered on OAI reference system and will step into a more
comprehensive design validation stage in 2020. In this workplace, panelists will present reference
system updates with power-on status, as well as demonstrate in the OCP Summit.